• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a conductor device comprising a resilient tubular outer casing (1) with an flexible printed circuit board (6) in the interior of the outer casing. A sensor (3) is arranged on the printed circuit board. The cavity (8a-c) in the outer casing adjacent to the sensor is filled with a rigid filling material (9). Detects that if the sensor can be affected by the conductor device being bent or otherwise mechanically actuated, the rigid filling material (9) prevents the sensor from being actuated. The outer casing (1) of the conductor device comprises an opening (7a-c) to a cavity (8a-c) in the outer casing adjacent to the sensor, through which filling material can be supplied in liquid form. Typically, the conductor device comprises two cavities (8a-b) in the outer casing on the side of the exemplary circuit board (6) where the sensor is located, one on one side of the sensor and the other on the other side of the sensor, and a third cavity (8c) in the outer casing on the side of the fl visible circuit board (6) that is on the opposite side from the sensor. In an advantageous embodiment, at least one cavity (8a-c) is surrounded in the outer casing on each side of the bulge (4a-í) which delimits the cavity. The distribution of added filling material is controlled by these bumps to the relevant area. Typically, the guide device is a catheter or part of a catheter. 6/6
    公开号:SE1400311A1
    申请号:SE1400311
    申请日:2014-06-19
    公开日:2015-12-20
    发明作者:Bengt Källbäck；Tiberiu Bagaian；Tobias Rokosch
    申请人:Cathprint Ab；
    IPC主号:
    专利说明:

    In an advantageous embodiment, at least one cavity 8a-c is surrounded in the outer casing on each side of bumps 4a-f which delimit the cavity. The distribution of added filling material is controlled by these bumps to the relevant area.
    Typically, the guide device is a catheter or part of a catheter.
    Brief description of the figures Fig. 1 shows a conductor device according to the prior art in partial cross-section seen from above Fig. 2 shows the conductor device according to the prior art in cross-section seen from the side Fig. 3 shows the conductor device according to the prior art in cross-section seen from the side when bending Fig. 4 shows a conductor device according to the invention in cross-section seen from the side in a first production step Fig. 5 shows the conductor device according to the invention in a second production stage Fig. 6 shows the conductor device according to the invention in a third production stage Description of a preferred embodiment Figures 1-3 shows a conductor device according to the prior art as a comparison with the invention.
    The conductor device consists of an elongate element in which electrical conductors extend in the longitudinal direction of the element. The guide device may be a catheter.
    Fig. 1 shows a conductor device according to the prior art in partial section seen from above.
    The conductor device comprises a cylindrical outer casing 1 in the interior of which an visible printed circuit board is arranged which extends in the longitudinal direction of the cylindrical outer casing. The Exemplary printed circuit board has conductors that extend in the longitudinal direction of the printed circuit board.
    On the visible printed circuit board there is a pressure sensor 3 which is intended to measure the liquid pressure on the surface of the conductor device. The pressure sensor is arranged below an opening in the cylindrical outer casing 1 and this entire opening is covered with a resilient, elastic material such as silicone. The silicone extends to the pressure sensor and covers it so that the pressure on the surface of the silicone in the opening on the cylindrical outer casing is transmitted to the pressure sensor. In addition, the silicone seals the opening, so that liquid or gas from the surroundings of the conductor device cannot penetrate into the interior of the conductor device.
    Fig. 2 shows the conductor device according to the prior art in cross-section seen from the side and here it is illustrated how the visible printed circuit board extends in the middle of the cylindrical outer casing.
    The pressure sensor 3 is attached to the top of the printed circuit board and is electrically connected to solder islands on the output of electrical conductors 5. To protect the attachment points of the electrical members on the solder islands, the solder islands are covered by a bulge 4 of a protective material, typically a rigid adhesive. The silicone which transmits the pressure from the environment of the conductor device to the pressure sensor has been pressed through the opening in the cylindrical outer casing and covers the immediate immediate vicinity of the entire pressure sensor all the way to the bulge 4.
    Fig. 3 shows the conductor device according to the prior art in cross-section seen from the side during bending.
    Because the conductor device is resilient, it can be bent in its entirety and this affects the pressure sensor. The bending of the conductor device provides a load on the silicone which the pressure sensor perceives as a pressure change relative to the actual pressure on the outer surface of the conductor device. In addition, this effect has been illustrated in an exaggerated way in order to emphasize the problem in that the pressure sensor here is somewhat diamond-shaped. The effect is in reality much smaller, but bending the conductor device still gives an incorrect pressure network. Bending of the conductor device can also affect other types of sensors than pressure gauges so that incorrect measurement values are obtained.
    Fig. 4 shows a conductor device according to the invention in cross-section seen from the side in a first production step. The conductor device comprises in a manner corresponding to the conductor device according to the prior art a cylindrical outer casing and in its interior extends a flexible printed circuit board 6. On the printed circuit board a pressure sensor 3 is attached and it is electrically connected to bonding surfaces on the board with electrical conductors. The bonding surfaces are covered by an approximately hemispherical bulge 4c of a protective material of a relatively rigid substance, typically a hard glue.
    The hemispherical bulge 4c extends over the visible printed circuit board top surface from one long side of the board to the opposite long side, and from the surface of the board to the inner surface of the cylindrical outer casing. In this way, the bulge seals so that at least viscous liquids cannot pass the bulge. The conductor device according to the invention further comprises three bumps 4a, b, d on the upper side of the card and in addition two bumps 3e-f on the underside of the card. All bulbs are approximately uniformly shaped and seal the interior of the conductor device in the same way.
    On the left side of the pressure sensor on the upper side of the card, two bumps 4a-b are arranged with a space in between which forms a first cavity 8a. Extending through the cylindrical outer tube is a first opening which forms a connection between the first cavity and the environment of the conductor device. On the right side of the pressure sensor on the upper side of the card, two bumps 4c-d are arranged with a space in between which forms a second cavity 8b. Extending through the cylindrical outer tube is a second opening which forms a connection between the second cavity and the environment of the conductor device.
    The pressure sensor is surrounded by two bumps 4b-c, one on each side, and the space between them is filled with silicone which transmits pressure from the surroundings of the conductor device via an opening in the cylindrical outer tube to the pressure sensor. When the silicone is applied to this cavity, the space the silicone can surface in is defined by these two bumps.
    On both sides of the pressure sensor on the underside of the card there are two further bumps 4e-f arranged with a space in between which forms a third cavity 8c. Extending through the cylindrical outer tube is a third 7c and a fourth 7c opening which forms a connection between the third cavity and the environment of the conductor device.
    Fig. 5 shows the conductor device according to the invention in a second production step where an adhesive 9 has been supplied to all three cavities 8a-c. The third cavity 8c has two openings 7c-d and typically adhesive is supplied through one opening 7c and air is forced out through the other opening. The first and second cavities can also be provided with two openings each, but in the illustrated embodiment the volume of the cavities is so small that this is not necessary.
    After the adhesive is added to the cavities in the liquid form, it cures and solidifies so that the portion of the conductor device surrounded by adhesive 9 forms a rigid portion. If the rest of the conductor device is bent, this piece remains immobile and the pressure sensor remains unaffected by a possible bend of the conductor device.
    Fig. 6 shows the conductor device according to the invention in a third production step, where a rigid cylindrical additional casing 10 is threaded over the rigid portion of the conductor device. The additional housing 10 covers the openings 7a-d. The additional housing means that the conductor device as a whole has an almost completely smooth surface and in addition provides additional stability for the rigid part.
    The bumps define the spread of the rigid adhesive when it is applied in a liquid form, but obviously in principle the adhesive could be applied without being delimited by such bumps, but it is then difficult to control the spread of the adhesive. In addition, one of the bumps 4c is a protective element for the leads to the pressure sensor, so there is a common process for producing such bumps when mounting components on printed circuit boards.
    Supplying an adhesive in the form of a cavity to the cavities where the latter solidifies is an effective way of creating a rigid portion on the conductor device, but even though the term adhesive is used, this term also refers to other substances which solidify from a surface to a hard material. . The silicone around the pressure sensor is a good way to protect the sensor and give the conductor device a nearly completely smooth surface, but is not absolutely necessary.
    权利要求:
    Claims (6)
    [1]
    Claim 1 A conductor device comprising a flexible tubular outer casing (1) with a flexible printed circuit board (6) in the interior of the outer casing, where at least one sensor (3) is arranged on the printed circuit board, characterized in that at least one cavity (8a-c) in the outer casing adjacent to the sensor is filled with a rigid filling material (9).
    [2]
    A conductor device according to claim 1, characterized in that the outer casing (1) comprises at least one opening (7a-c) to at least one cavity (8a-c) in the outer casing adjacent to the sensor.
    [3]
    A conductor device according to claim 1 or 2, characterized in that the conductor device comprises two cavities (8a-c) in the outer casing on the side of the visible printed circuit board (6) where the sensor is located, one on one side of the sensor and the second on the other side of the sensor, and a third cavity (8a-c) in the outer housing on the side of the visible printed circuit board (6) which is on the opposite side from the sensor.
    [4]
    A conductor device according to any one of the preceding claims, characterized in that at least one cavity (8a-c) in the outer casing is surrounded on each side by bumps (4a-t) which delimit the cavity.
    [5]
    A conductor device according to any one of the preceding claims, characterized in that the conductor device is surrounded by an additional rigid housing (10).
    [6]
    A guide device according to any one of the preceding claims, characterized in that the guide device forms a catheter or part of a catheter.
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    同族专利:
    公开号 | 公开日
    EP3157606A1|2017-04-26|
    SE539551C2|2017-10-10|
    WO2015195023A1|2015-12-23|
    EP3157606A4|2018-04-04|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JPS5921495B2|1977-12-15|1984-05-21|Toyoda Chuo Kenkyusho Kk|
    US6394986B1|1999-11-06|2002-05-28|Millar Instruments, Inc.|Pressure sensing module for a catheter pressure transducer|
    US20040230114A1|2003-03-18|2004-11-18|Clatterbaugh Guy V.|MRI flex circuit catheter imaging coil|
    US7630747B2|2003-09-09|2009-12-08|Keimar, Inc.|Apparatus for ascertaining blood characteristics and probe for use therewith|
    JP4426430B2|2004-12-15|2010-03-03|日東電工株式会社|Catheter and manufacturing method thereof|
    JP4648063B2|2005-04-19|2011-03-09|日東電工株式会社|Flexible wiring circuit board for catheter, catheter using the flexible wiring circuit board, and manufacturing method thereof|
    WO2007139479A1|2006-06-01|2007-12-06|Cathprint Ab|Tubular catheter for invasive use and manufacturing method therefor|
    WO2013074036A1|2011-11-16|2013-05-23|Cathprint Ab|Catheter component|US11185244B2|2018-08-13|2021-11-30|Medtronic Vascular, Inc.|FFR catheter with suspended pressure sensor|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    SE1400311A|SE539551C2|2014-06-19|2014-06-19|Conductor device with a resilient tubular outer casing with flexible pattern board in the outer casing|SE1400311A| SE539551C2|2014-06-19|2014-06-19|Conductor device with a resilient tubular outer casing with flexible pattern board in the outer casing|
    PCT/SE2015/000037| WO2015195023A1|2014-06-19|2015-06-17|A conductor assembly comprising a resilient tubular outer casing|
    EP15809576.0A| EP3157606A4|2014-06-19|2015-06-17|A conductor assembly comprising a resilient tubular outer casing|
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